Major Projects in the USA

To expand our footprint and strengthen America’s semiconductor industry, TSMC USA is investing in multiple large-scale projects:

TSMC Arizona – Fab 21

• Location: Phoenix, Arizona

• Key Features:

• • Two state-of-the-art fabrication plants (fabs)

  • 5nm and 4nm chip production (Phase 1)

  • Advanced 3nm production (Phase 2)

  • Expected to create thousands of high-tech jobs

  • Partnerships with U.S. universities to develop semiconductor talent

TSMC R&D Center – Silicon Valley

• Location: San Jose, California

• Focus: Cutting-edge research in AI-driven chip design, quantum computing, and emerging semiconductor technologies.

• Objective: Strengthen collaboration with U.S. technology companies and universities to accelerate semiconductor innovation.

Upcoming Projects & Expansion Plans

To further enhance our presence in the U.S. and support the growing demand for semiconductor manufacturing, TSMC USA is setting up additional facilities, including:

• Advanced Packaging Facility (Planned for 2025-2026)

  • Focus on chiplet technology and 3D packaging solutions.

  • Enhancing high-performance computing and AI capabilities.

• Second Semiconductor Fab (Potential Future Expansion)

  • Considering additional fabs in the U.S. to boost production capacity.

  • Evaluating locations based on infrastructure, talent availability, and strategic partnerships.